Molex Micro-Latch Series Straight Through Hole PCB Header, 3 Contact(s), 2 mm Pitch, 1 Row, Shrouded

N° de stock RS:: 688-3283
Référence fabricant:: 53253-0370
Fabricant:: Molex

Molex Micro-Latch Series Straight Through Hole PCB Header, 3 Contact(s), 2 mm Pitch, 1 Row, Shrouded

Offre groupée disponible

Sous-total (1 paquet de 5 unités)*

0,92 €

(TVA exclue)

1,115 €

(TVA incluse)

Frais de livraison offerts pour toute commande de plus de 75,00 €

En stock

155 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
Plus 390 unité(s) expédiée(s) à partir du 22 décembre 2025

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Unité	Prix par unité	le paquet*
5 - 120	0,184 €	0,92 €
125 - 495	0,13 €	0,65 €
500 - 2495	0,128 €	0,64 €
2500 - 4995	0,122 €	0,61 €
5000 +	0,12 €	0,60 €

*Prix donné à titre indicatif

N° de stock RS:: 688-3283
Référence fabricant:: 53253-0370
Fabricant:: Molex

Spécifications

Documentation technique

Législations et de normes

Détails du produit

Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.

Sélectionner tout	Attribut	Valeur
	Marque	Molex
	Series	Micro-Latch
	Product Type	PCB Header
	Pitch	2mm
	Current	2A
	Number of Contacts	3
	Housing Material	Nylon
	Number of Rows	1
	Orientation	Straight
	Shrouded/Unshrouded	Shrouded
	Mount Type	Through Hole
	Connector System	Wire-to-Board
	Contact Material	Brass
	Contact Plating	Tin
	Termination Type	Solder
	Row Pitch	2mm
	Minimum Operating Temperature	-40°C
	Contact Gender	Male
	Maximum Operating Temperature	105°C
	Standards/Approvals	No
	Voltage	125 V

	Sélectionner tout
	Marque Molex
	Series Micro-Latch
	Product Type PCB Header
	Pitch 2mm
	Current 2A
	Number of Contacts 3
	Housing Material Nylon
	Number of Rows 1
	Orientation Straight
	Shrouded/Unshrouded Shrouded
	Mount Type Through Hole
	Connector System Wire-to-Board
	Contact Material Brass
	Contact Plating Tin
	Termination Type Solder
	Row Pitch 2mm
	Minimum Operating Temperature -40°C
	Contact Gender Male
	Maximum Operating Temperature 105°C
	Standards/Approvals No
	Voltage 125 V

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Molex Micro-Latch Series PCB Header, 2mm Pitch, 3 Contacts - 53253-0370

This PCB header features a 2mm pitch configuration. Designed as a vertical connector, it boasts three circuits housed within a shrouded design. The through-hole connector is tailored for wire-to-board applications, ensuring reliable solder termination while facilitating accurate alignment and efficient signal transmission.

Features & Benefits

• Shrouded design maximises protection against accidental disconnections

• Brass contact material enhances electrical conductivity and durability

• Rated for 2A current, supporting various electronic applications

• Compatible with a recommended PCB thickness of 1.60mm

• Vertical orientation allows for efficient space management on PCBs

• Durable construction ensures up to 30 mating cycles for longevity

Applications

• Suitable for connecting signals in automated equipment

• Utilised in electrical control panels for reliable board connections

• Implemented in mechanical devices requiring Compact wiring solutions

• Perfect for interfacing various electronic components in devices

What is the importance of using a shrouded design in connectors?

The shrouded design enhances the integrity of connections by preventing misalignment and protecting the contacts from external interference or damage, ensuring stable performance in critical applications.

How does the choice of brass for the contacts impact reliability?

Brass offers superior conductivity compared to other materials, which ensures efficient current flow while maintaining durability under mechanical stress, making it Ideal for long-term use.

How does the vertical orientation of the header facilitate installation?

Vertical orientation simplifies insertion into PCBs, allowing for easier access and reducing the risk of incorrect placement, which is particularly beneficial in tight spaces.

What is the significance of a recommended PCB thickness of 1.60mm?

Adhering to the recommended thickness ensures optimal fit and stability, reducing the likelihood of connection failures and enhancing overall circuit reliability in operation.