Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 10 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Offre groupée disponible

Sous-total (1 paquet de 5 unités)*

19,13 €

(TVA exclue)

23,145 €

(TVA incluse)

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  • Expédition à partir du 23 avril 2026
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Unité
Prix par unité
le paquet*
5 - 953,826 €19,13 €
100 - 3703,076 €15,38 €
375 - 14952,694 €13,47 €
1500 - 29952,222 €11,11 €
3000 +2,078 €10,39 €

*Prix donné à titre indicatif

Options de conditionnement :
N° de stock RS:
670-2235
Référence fabricant:
43650-1025
Fabricant:
Molex
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Marque

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Number of Contacts

10

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-62-235

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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