Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 16 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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21,18 €

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25,63 €

(TVA incluse)

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Unité
Prix par unité
le paquet*
5 - 954,236 €21,18 €
100 - 3702,978 €14,89 €
375 - 14952,722 €13,61 €
1500 +2,412 €12,06 €

*Prix donné à titre indicatif

Options de conditionnement :
N° de stock RS:
422-7439
Référence fabricant:
43045-1600
Fabricant:
Molex
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Marque

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

8.5A

Housing Material

High Temperature Thermoplastic

Number of Contacts

16

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Contact Gender

Male

Mating Pin Length

3mm

Standards/Approvals

No

Voltage

600 V

Distrelec Product Id

304-28-344

Molex Micro-Fit 3.0 Series PCB Header, 16 Contacts, 3.0mm Pitch - 43045-1600


This PCB header connector is designed for robust wire-to-board applications. Featuring a dual row arrangement with 16 circuits, it includes a right angle orientation and is shrouded for safety. The through-hole mounting style ensures secure attachment, making it Ideal for various electronic devices.

Features & Benefits


• Surface mount compatible, increasing installation flexibility

• Glow wire compliant, enhancing fire safety in requirements

• High current rating of 8.5A, suitable for powerful devices

• Precision 3.0mm pitch, ensuring optimal connectivity

• Durable brass contacts with tin plating for reliable performance

• Designed for PCB thickness of 1.60mm for standardisation

Applications


• Used for connecting power in automation systems

• Ideal for electronic devices requiring high current transfer

• Suitable for industrial machinery and electrical systems

• Recommended for consumer electronics and appliances

What is the maximum operating temperature for this connector?


The connector operates effectively within a temperature range of -40 to +105 °C, ensuring performance under various conditions.

How does the shrouded design improve safety during use?


The shrouded feature protects against accidental contact with live terminals, reducing risk during installation and maintenance.

What are the recommended soldering conditions for optimal performance?


It is advised to maintain a maximum process temperature of 260°C for a duration of 30 seconds, with up to three cycles allowed during soldering.

How can I evaluate its suitability for my specific application?


Conduct thorough testing or consult the specified flammability standards to ensure compatibility with your project requirements.

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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