Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54 mm Pitch, 1 Row,
- N° de stock RS:
- 236-4664
- Référence fabricant:
- 77311-124-03LF
- Fabricant:
- Amphenol Communications Solutions
Offre groupée disponible
Sous-total (1 paquet de 20 unités)*
5,78 €
(TVA exclue)
7,00 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 25 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le paquet* |
|---|---|---|
| 20 - 80 | 0,289 € | 5,78 € |
| 100 - 180 | 0,262 € | 5,24 € |
| 200 - 380 | 0,231 € | 4,62 € |
| 400 + | 0,218 € | 4,36 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 236-4664
- Référence fabricant:
- 77311-124-03LF
- Fabricant:
- Amphenol Communications Solutions
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol Communications Solutions | |
| Product Type | Pin Header | |
| Series | Bergstik | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol Communications Solutions | ||
Product Type Pin Header | ||
Series Bergstik | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Standards/Approvals No | ||
- Pays d'origine :
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Liens connexes
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