Molex Micro-Fit Series Right Angle Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- N° de stock RS:
- 228-2574
- Numéro d'article Distrelec:
- 304-31-490
- Référence fabricant:
- 215760-1003
- Fabricant:
- Molex
Offre groupée disponible
Sous-total (1 paquet de 10 unités)*
12,66 €
(TVA exclue)
15,32 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
En stock
- 2 820 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
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Unité | Prix par unité | le paquet* |
|---|---|---|
| 10 - 90 | 1,266 € | 12,66 € |
| 100 + | 1,149 € | 11,49 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 228-2574
- Numéro d'article Distrelec:
- 304-31-490
- Référence fabricant:
- 215760-1003
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Series | Micro-Fit | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Current | 13A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Micro Fit Connector System | |
| Mount Type | Through Hole | |
| Contact Plating | Matt Tin | |
| Contact Material | High Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 600 Vrms | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Series Micro-Fit | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Current 13A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Micro Fit Connector System | ||
Mount Type Through Hole | ||
Contact Plating Matt Tin | ||
Contact Material High Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 600 Vrms | ||
- Pays d'origine :
- CN
The Molex Product SPEC covers the Micro-Fit Plus 3.00 mm centerline Wire to Board connector system with gold and tin plating. Receptacle are terminated with 16 to 30 AWG wire using crimp technology.
Micro-Fit+ connector is a wire-to-board system
Higher-current rating of 12.5A
Superior design options for flexibility and efficient assembly
Unique keying design
Fully polarized housings
Reduces labor costs, saves time and resources
Enhanced TPA design
Liens connexes
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