Samtec TFM Series Vertical Through Hole PCB Header, 30 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 227-1893
- Référence fabricant:
- TFM-115-02-S-D-LC-P-TR
- Fabricant:
- Samtec
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 227-1893
- Référence fabricant:
- TFM-115-02-S-D-LC-P-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Header | |
| Series | TFM | |
| Pitch | 1.27mm | |
| Current | 3.2A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Row Pitch | 1.27mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 250 V | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Header | ||
Series TFM | ||
Pitch 1.27mm | ||
Current 3.2A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Row Pitch 1.27mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 250 V | ||
The Samtec TFM series has 15 positions per row and 2 lead style. It has 0.000762mm selective gold on contact area and matte tin on tail.
Dual row
Locking clip
Plastic pick & place pad
Tape and reel packaging
Liens connexes
- Samtec TFM Series Vertical Through Hole PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Through Hole PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Through Hole PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Through Hole PCB Header 1.27 mm Pitch Shrouded