Samtec TFM Series Vertical Through Hole PCB Header, 8 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 227-1869
- Référence fabricant:
- TFM-104-02-L-D-K-TR
- Fabricant:
- Samtec
Offre groupée disponible
Sous-total (1 paquet de 5 unités)*
9,24 €
(TVA exclue)
11,18 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- 115 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le paquet* |
|---|---|---|
| 5 - 45 | 1,848 € | 9,24 € |
| 50 - 120 | 1,68 € | 8,40 € |
| 125 - 245 | 1,54 € | 7,70 € |
| 250 + | 1,42 € | 7,10 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1869
- Référence fabricant:
- TFM-104-02-L-D-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Series | TFM | |
| Product Type | PCB Header | |
| Current | 3.2A | |
| Pitch | 1.27mm | |
| Number of Contacts | 8 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 250 V | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Series TFM | ||
Product Type PCB Header | ||
Current 3.2A | ||
Pitch 1.27mm | ||
Number of Contacts 8 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 250 V | ||
The Samtec TFM series has 4 positions per row and 2 lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Polyimide film pick & place pad
Tape and reel packaging
Liens connexes
- Samtec TFM Series Vertical Through Hole PCB Header 1.27 mm Pitch Shrouded
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- Samtec TFM Series Vertical Through Hole and Surface Mount PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec TFM Series Vertical Surface PCB Header 1.27 mm Pitch Shrouded