Molex Micro-Fit Series Vertical Through Hole PCB Header, 18 Contact(s), 3 mm Pitch, 2 Row, Shrouded

N° de stock RS:: 200-9816
Référence fabricant:: 206832-1802
Fabricant:: Molex

Molex Micro-Fit Series Vertical Through Hole PCB Header, 18 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Offre groupée disponible

Sous-total (1 unité)*

6,90 €

(TVA exclue)

8,35 €

(TVA incluse)

Frais de livraison offerts pour toute commande de plus de 75,00 €

Dernier stock RS

740 dernière(s) unité(s), prête(s) à l'envoi d'un autre centre de distribution

Unité	Prix par unité
1 - 9	6,90 €
10 - 49	6,03 €
50 +	5,80 €

*Prix donné à titre indicatif

N° de stock RS:: 200-9816
Référence fabricant:: 206832-1802
Fabricant:: Molex

Spécifications

Documentation technique

Législations et de normes

Détails du produit

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Sélectionner tout	Attribut	Valeur
	Marque	Molex
	Product Type	PCB Header
	Series	Micro-Fit
	Current	12.5A
	Pitch	3mm
	Number of Contacts	18
	Housing Material	Liquid Crystal Polymer
	Number of Rows	2
	Orientation	Vertical
	Shrouded/Unshrouded	Shrouded
	Mount Type	Through Hole
	Connector System	Wire-to-Board
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Minimum Operating Temperature	-40°C
	Termination Type	Solder
	Tail Pin Length	3.18mm
	Maximum Operating Temperature	105°C
	Contact Gender	Male
	Standards/Approvals	No
	Voltage	600 V

	Sélectionner tout
	Marque Molex
	Product Type PCB Header
	Series Micro-Fit
	Current 12.5A
	Pitch 3mm
	Number of Contacts 18
	Housing Material Liquid Crystal Polymer
	Number of Rows 2
	Orientation Vertical
	Shrouded/Unshrouded Shrouded
	Mount Type Through Hole
	Connector System Wire-to-Board
	Contact Material Copper Alloy
	Contact Plating Gold
	Minimum Operating Temperature -40°C
	Termination Type Solder
	Tail Pin Length 3.18mm
	Maximum Operating Temperature 105°C
	Contact Gender Male
	Standards/Approvals No
	Voltage 600 V

Datasheet - 206832-1802

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Pays d'origine :: CN

Molex 206832 Series PCB Header, 3mm Pitch, 18 Contacts - 206832-1802

This PCB header is part of the Micro-Fit+ connector system, designed for reliable connections in electronic applications. Featuring a compact 3.0mm pitch, this vertical mount header accommodates 18 contacts across two rows, ensuring efficient connectivity. The shrouded design enhances protection for connections, making it ideal for demanding environments.

Features & Benefits

• Made from high copper alloy for superior conductivity

• Gold plating provides resistance to corrosion and wear

• Suitable for a 12A current rating for high power applications

• Optimised for a temperature range from -40°C to +105°C

• Through hole termination style ensures robust PCB attachment

• Glow-wire capable, meeting stringent safety requirements

Applications

• Suitable for power distribution in automated machinery

• Used for wire-to-board connections in electronic devices

• Ideal for requiring high current performance

• Compatible with other Micro-Fit+ components for versatile use

What makes the connector suitable for high-power applications?

The connector supports a 12A current rating, ensuring it can handle high power without overheating, making it ideal for demanding electrical systems. Its high copper alloy construction further enhances conductivity and performance reliability.

How does the shrouded design benefit usage?

The shrouded design protects the contacts from accidental disconnection and environmental interference, providing a stable connection in various operational settings.

What is the significance of the gold plating?

Gold plating on the contacts enhances durability and prevents corrosion, ensuring long-term reliability and improved performance in critical electronic applications.

What environments can this connector be used in?

Its operational temperature range of -40°C to +105°C makes it suitable for harsh conditions, including industrial environments and outdoor applications.

How does the through hole design contribute to installation?

The through hole termination style allows for secure soldering onto PCBs, providing a strong mechanical bond and reducing the risk of failure under vibration or movement.