Amphenol ICC 98464 Series Right Angle Through Hole PCB Header, 10 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 799-064
- Référence fabricant:
- 98464-G61-10ULF
- Fabricant:
- Amphenol ICC
Visuel non contractuel
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 799-064
- Référence fabricant:
- 98464-G61-10ULF
- Fabricant:
- Amphenol ICC
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol ICC | |
| Series | 98464 | |
| Product Type | PCB Header | |
| Current | 2A | |
| Pitch | 2mm | |
| Number of Contacts | 10 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Board-to-Board, Wire-to-Board | |
| Contact Plating | Gold or Tin over Nickel | |
| Contact Material | Phosphor Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | UL94V-0 | |
| Voltage | 650V | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol ICC | ||
Series 98464 | ||
Product Type PCB Header | ||
Current 2A | ||
Pitch 2mm | ||
Number of Contacts 10 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Board-to-Board, Wire-to-Board | ||
Contact Plating Gold or Tin over Nickel | ||
Contact Material Phosphor Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals UL94V-0 | ||
Voltage 650V | ||
- Pays d'origine :
- FR
The Amphenol ICC Minitek header is an Advanced connector is designed for Pin-in-Paste processes, ensuring reliable soldering for both board-to-board and wire-to-board applications while supporting high mechanical strength essential for various industrial settings.
Compatible with IR reflow soldering processes for efficient assembly
Insulation resistance rating of 1000ΩM minimum for enhanced reliability
Available in a variety of pin configurations, optimising compatibility with diverse applications
Moulded in high temperature thermoplastic, ensuring durability at elevated temperatures
Liens connexes
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