Molex 203564 Series Vertical Surface PCB Header, 40 Contact(s), 1 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 798-919
- Référence fabricant:
- 203564-4017
- Fabricant:
- Molex
Visuel non contractuel
Sous-total (1 bobine de 1100 unités)*
4 566,00 €
(TVA exclue)
5 524,86 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Nouveau produit - précommandez dès aujourd'hui
- Expédition à partir du 30 novembre 2026
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Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 4 566,00 € | 4,151 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 798-919
- Référence fabricant:
- 203564-4017
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Series | 203564 | |
| Product Type | PCB Header | |
| Pitch | 1mm | |
| Housing Material | Polyamide | |
| Number of Contacts | 40 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Material | Bronze | |
| Contact Plating | Gold | |
| Termination Type | Surface Mount | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Series 203564 | ||
Product Type PCB Header | ||
Pitch 1mm | ||
Housing Material Polyamide | ||
Number of Contacts 40 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Material Bronze | ||
Contact Plating Gold | ||
Termination Type Surface Mount | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- Pays d'origine :
- MY
The Molex PCB Header is designed for efficient connectivity in electronic applications, featuring a dual-row layout and a secure surface mount configuration.
1.00mm pitch design ensures Compact integration within electronic devices
Dual row configuration allows for higher circuit density
Surface mount style facilitates easy PCB assembly
0.38μm gold plating enhances conductivity and durability
Includes an inner positive lock mechanism for secure connections
Liens connexes
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