Molex J-Bend Series Right Angle Surface PCB Header, 24 Contact(s), 0.4 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 796-455
- Référence fabricant:
- 500913-0242
- Fabricant:
- Molex
Sous-total (1 bobine de 1500 unités)*
1 628,44 €
(TVA exclue)
1 970,41 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Nouveau produit - précommandez dès aujourd'hui
- Expédition à partir du 08 décembre 2026
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Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 628,44 € | 1,086 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 796-455
- Référence fabricant:
- 500913-0242
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Product Type | PCB Header | |
| Series | J-Bend | |
| Current | 0.3A | |
| Pitch | 0.4mm | |
| Number of Contacts | 24 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | REACH SVHC Not Contained | |
| Voltage | 50V ac/dc | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Product Type PCB Header | ||
Series J-Bend | ||
Current 0.3A | ||
Pitch 0.4mm | ||
Number of Contacts 24 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals REACH SVHC Not Contained | ||
Voltage 50V ac/dc | ||
- Pays d'origine :
- JP
The Molex Board-to-Board Receptacle offers a high-density interconnection solution for modern, space-constrained electronics. Featuring a precision 0.40mm pitch and J-Bend series leads, this component facilitates reliable surface mount attachment. The Compact 4.20mm width and versatile profile options make it Ideal for slim mobile or wearable device architectures.
Twenty-four circuits for multi-signal routing
Mated height of 1.80mm to 2.30mm
J-Bend terminals for robust solder joints
Low-profile 4.20mm mated width
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