Molex 171974 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- N° de stock RS:
- 788-083
- Référence fabricant:
- 171974-0104
- Fabricant:
- Molex
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau en stock, il n'est plus vendu par le fabricant.
- N° de stock RS:
- 788-083
- Référence fabricant:
- 171974-0104
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Series | 171974 | |
| Product Type | PCB Header | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Housing Material | Polymer | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 250V | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Series 171974 | ||
Product Type PCB Header | ||
Current 3A | ||
Pitch 2.54mm | ||
Housing Material Polymer | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 250V | ||
- Pays d'origine :
- MY
The Molex PCB header is designed to provide reliable and efficient electrical connections across various applications, optimising performance and durability in demanding environments.
Robust design ensures exceptional reliability in challenging conditions
Facilitates seamless integration with a wide range of existing systems
Offers versatility for various connectivity configurations
Enhances performance with high-speed data transmission capabilities
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