Molex 105309 Series Vertical Through Hole PCB Header, 5 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded
- N° de stock RS:
- 787-621
- Référence fabricant:
- 105309-1305
- Fabricant:
- Molex
Sous-total (1 plateau de 200 unités)*
459,01 €
(TVA exclue)
555,40 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Nouveau produit - précommandez dès aujourd'hui
- Expédition à partir du 20 octobre 2026
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Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 459,01 € | 2,295 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 787-621
- Référence fabricant:
- 105309-1305
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Product Type | PCB Header | |
| Series | 105309 | |
| Current | 8A | |
| Pitch | 2.5mm | |
| Number of Contacts | 5 | |
| Housing Material | Polymer | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Brass | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 250V | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Product Type PCB Header | ||
Series 105309 | ||
Current 8A | ||
Pitch 2.5mm | ||
Number of Contacts 5 | ||
Housing Material Polymer | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Brass | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 105°C | ||
Voltage 250V | ||
- Pays d'origine :
- CN
The Molex Header serves as an innovative electrical interconnect solution, specifically designed for seamless integration in various applications. Its versatile architecture facilitates efficient connection management for reliable performance in demanding environments.
Active Nano-Fit design ensures secure connections with kinked pins for enhanced integrity
Through-hole mounting facilitates simplified installation and assembly processes
2.50mm pitch spacing optimises Compact layout for space-constrained applications
Gold plating (0.76μm) enhances conductivity and resistance to corrosion
Glow-Wire capable, meeting stringent safety standards for high-temperature environments
Liens connexes
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