Amphenol ICC 10075025 Series Straight Through Hole PCB Header, 20 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 787-611
- Référence fabricant:
- 10075025-G01-20ULF
- Fabricant:
- Amphenol ICC
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau en stock, il n'est plus vendu par le fabricant.
- N° de stock RS:
- 787-611
- Référence fabricant:
- 10075025-G01-20ULF
- Fabricant:
- Amphenol ICC
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol ICC | |
| Series | 10075025 | |
| Product Type | PCB Header | |
| Pitch | 2mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Row Pitch | 2mm | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol ICC | ||
Series 10075025 | ||
Product Type PCB Header | ||
Pitch 2mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Row Pitch 2mm | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
- Pays d'origine :
- FR
The Amphenol Header is designed to ensure reliable connections in demanding environments. Its robust construction and precise engineering provide exceptional performance for various applications while maintaining durability and integrity.
Constructed for longevity, ensuring reliable performance over time
Designed to withstand harsh environmental conditions without compromising functionality
Features precise engineering for consistent and efficient connectivity
Optimised for enhanced signal integrity across diverse applications
Liens connexes
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