Amphenol ICC 20021111 Series Straight Through Hole PCB Header, 16 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded
- N° de stock RS:
- 786-383
- Référence fabricant:
- 20021111-00016T4LF
- Fabricant:
- Amphenol ICC
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau en stock, il n'est plus vendu par le fabricant.
- N° de stock RS:
- 786-383
- Référence fabricant:
- 20021111-00016T4LF
- Fabricant:
- Amphenol ICC
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol ICC | |
| Product Type | PCB Header | |
| Series | 20021111 | |
| Pitch | 1.27mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Copper | |
| Contact Material | Copper | |
| Termination Type | Through Hole | |
| Row Pitch | 1.27mm | |
| Contact Gender | Male | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol ICC | ||
Product Type PCB Header | ||
Series 20021111 | ||
Pitch 1.27mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Copper | ||
Contact Material Copper | ||
Termination Type Through Hole | ||
Row Pitch 1.27mm | ||
Contact Gender Male | ||
- Pays d'origine :
- CN
The Amphenol Connector solution designed for varied applications, ensuring secure and efficient connectivity in demanding environments. Its robust construction and functionality support seamless integration into existing systems.
Manufactured to meet stringent industry standards for quality and performance
Features a Compact design that allows for easy installation in space-constrained areas
Constructed from Durable materials, ensuring longevity and resistance to environmental factors
Designed for high-performance applications, facilitating optimal data transmission and connectivity
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