Molex 44432 Series Vertical Through Hole Header, 24 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 694-088
- Référence fabricant:
- 44432-2401
- Fabricant:
- Molex
Visuel non contractuel
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 694-088
- Référence fabricant:
- 44432-2401
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Product Type | Header | |
| Series | 44432 | |
| Pitch | 3mm | |
| Current | 8.5A | |
| Number of Contacts | 24 | |
| Housing Material | Nylon | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 3.30mm | |
| Standards/Approvals | UL E29179 | |
| Mating Pin Length | 33mm | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Product Type Header | ||
Series 44432 | ||
Pitch 3mm | ||
Current 8.5A | ||
Number of Contacts 24 | ||
Housing Material Nylon | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 3.30mm | ||
Standards/Approvals UL E29179 | ||
Mating Pin Length 33mm | ||
- Pays d'origine :
- US
The Molex Micro-Fit BMI Header is engineered for versatile applications in power and signal connectivity. Designed with a dual-row configuration and featuring 24 circuits, this vertical header provides robust PCB integration, ensuring superior electrical performance. Constructed with a polarizing peg to enhance stability, it is Ideal for board-to-board connections and wire-to-board configurations. The use of tin plating on both mating and termination surfaces ensures reliability and durability, while the high-temperature rated materials can withstand operational conditions from -40°C to +105°C. Offering a hard-wearing nylon resin body, this component is a dependable choice for demanding environments.
Constructed from high-temperature materials, ensuring operational stability
Tin plating offers excellent conductivity and corrosion resistance
Recommended for use with various Molex products to ensure compatibility
Achieves compliance with EU RoHS and GADSL/IMDS standards for environmental safety
Break away feature supports easy disassembly and maintenance
Tin plating offers excellent conductivity and corrosion resistance
Recommended for use with various Molex products to ensure compatibility
Achieves compliance with EU RoHS and GADSL/IMDS standards for environmental safety
Break away feature supports easy disassembly and maintenance
Liens connexes
- Molex 44432 Series Vertical Through Hole Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical Through Hole Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical Through Hole Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical Through Hole Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical Through Hole Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical Through Hole PCB Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical Through Hole PCB Header 3 mm Pitch Shrouded
- Molex 44432 Series Vertical PCB PCB Header 3 mm Pitch Shrouded