Molex 501331 Series Vertical Surface PCB Header, 13 Contact(s), 1 mm Pitch, 1 Row, Shrouded
- N° de stock RS:
- 693-994
- Référence fabricant:
- 501331-1327
- Fabricant:
- Molex
Sous-total (1 bobine de 500 unités)*
225,76 €
(TVA exclue)
273,17 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 03 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 225,76 € | 0,452 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 693-994
- Référence fabricant:
- 501331-1327
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Product Type | PCB Header | |
| Series | 501331 | |
| Pitch | 1mm | |
| Current | 1A | |
| Number of Contacts | 13 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Contact Plating | Tin | |
| Contact Material | Phosphor Bronze | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Product Type PCB Header | ||
Series 501331 | ||
Pitch 1mm | ||
Current 1A | ||
Number of Contacts 13 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Contact Plating Tin | ||
Contact Material Phosphor Bronze | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
- Pays d'origine :
- JP
The Molex 1.00mm pitch Pico-Clasp PCB header features a single row vertical surface mount design with tin plating and an inner positive lock, supporting 13 circuits in red color, Ideal for Compact and secure wire-to-board connections in space-constrained electronic assemblies.
Metal material used is phosphor bronze
Mating surface is plated with tin
Termination surface is plated with tin
Resin material used is nylon
Mating surface is plated with tin
Termination surface is plated with tin
Resin material used is nylon
Liens connexes
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