Molex 43160 Series Vertical Through Hole Header, 5 Contact(s), 7.50 mm Pitch, 1 Row, Shrouded

Sous-total (1 plateau de 100 unités)*

211,00 €

(TVA exclue)

255,31 €

(TVA incluse)

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  • Expédition à partir du 29 juin 2026
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le plateau
Prix par unité*
1 +211,00 €2,11 €

*Prix donné à titre indicatif

N° de stock RS:
693-902
Référence fabricant:
43160-0305
Fabricant:
Molex
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Marque

Molex

Product Type

Header

Series

43160

Pitch

7.50mm

Current

18A

Housing Material

High Temperature Thermoplastic

Number of Contacts

5

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

75°C

Tail Pin Length

5.33mm

Standards/Approvals

CSA LR19980, UL E29179

Pays d'origine :
MX
The Molex Sabre Vertical Header is engineered for high performance in power and wire-to-board applications, accommodating up to five circuits with a robust design that ensures durability and reliability. Constructed from high temperature thermoplastic, this header is glow-wire capable, boasting an ignition temperature of at least 775°C and a flammability rating of 94V-0. It features fully polarized contacts, providing secure connections and exceptional safety in demanding environments. Designed for a PCB thickness of 2.40mm, the connector ensures ease of use with its vertical orientation and through-hole termination interface, making it an excellent choice for contemporary electrical projects that require assurance and compliance with international safety standards.

High-temperature thermoplastic construction provides resistance against heat
Compact design features five circuits for efficient use of space in applications
Vertical orientation optimizes PCB real estate, Ideal for dense configurations
Through-hole termination Interface allows for secure mounting on PCBs
Rated for a temperature range from -40° to +75°C for versatile application suitability

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