Molex 76829 Series Vertical Through Hole PCB Header, 10 Contact(s), 5.70 mm Pitch, 2 Row, Shrouded

Sous-total (1 plateau de 60 unités)*

210,14 €

(TVA exclue)

254,27 €

(TVA incluse)

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1 +210,14 €3,502 €

*Prix donné à titre indicatif

N° de stock RS:
693-658
Référence fabricant:
76829-0010
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

76829

Pitch

5.70mm

Current

23.5A

Housing Material

Liquid Crystal Polymer

Number of Contacts

10

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Material

High Conductive Copper Alloy

Contact Plating

Matte Tin

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Row Pitch

5.70mm

Tail Pin Length

3.73mm

Maximum Operating Temperature

105°C

Mating Pin Length

3.73mm

Standards/Approvals

EU RoHS Compliant

Pays d'origine :
CN
The Molex Mega-Fit Vertical Header is a robust interconnect solution designed for power applications requiring dependable connectivity. Crafted for PCB Headers and Receptacles, this component supports up to 10 circuits and accommodates a maximum current of 23.5A at 600V AC/DC. Its dual-row design features a 5.70mm pitch, ensuring a Compact footprint while also enabling secure mating with other components. The header is built with high conductivity copper for optimal electrical performance and is finished with a matte tin plating, providing durability and corrosion resistance. Ideal for stringent applications, it boasts specifications including glow-wire capability and a temperature range of -40° to +105°C, ensuring reliable operation in various environments.

Supports up to 10 circuits for versatile power connection
Current handling of 23.5A maximises power efficiency
Voltage rating of 600V AC/DC enhances its utility in diverse applications
Glow-wire capable design ensures adherence to safety standards
Vertical orientation and dual-row design save PCB space, optimising layout
Compatible with multiple receptacle options for flexible integration into existing systems

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