Molex 70543 Series Vertical PCB Header, 18 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Sous-total (1 tube de 50 unités)*

216,26 €

(TVA exclue)

261,67 €

(TVA incluse)

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Stocké-e par le fabricant
  • Prêt à être expédié à partir du 02 juillet 2026
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Tube(s)
le tube
Prix par unité*
1 +216,26 €4,325 €

*Prix donné à titre indicatif

N° de stock RS:
693-598
Référence fabricant:
70543-0052
Fabricant:
Molex
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Marque

Molex

Series

70543

Product Type

Header

Current

3A

Pitch

2.54mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

18

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Contact Plating

Tin

Contact Material

Brass and Phosphor Bronze

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS Compliant

Voltage

250V

Pays d'origine :
MY
The Molex SL Header is a highly versatile solution designed for reliable wire-to-board connections in various electronic applications. This single-row vertical header boasts a 2.54mm pitch and features shrouded design with 18 circuits, ensuring a secure and robust interconnection. Ideal for PCB headers and receptacles, it offers excellent durability with up to 25 mating cycles, making it suitable for high-performance requirements. The header is constructed from high-temperature thermoplastic and brass, providing resilience against harsh environments while maintaining compliance with critical industry standards. Whether for signal applications or more demanding uses, the SL Header ensures optimal functionality for your designs.

Constructed with high-temperature thermoplastic for durability and reliability

Features 18 circuits for efficient signal transmission and board space optimisation

Utilises tin plating for excellent conductivity and corrosion resistance

Designed for through-hole soldering, facilitating easier PCB integration

Vertical orientation enables efficient use of space in Compact electronic designs

Solder process capability includes a lead-free process option, promoting environmental compliance

Compatible with various single-row crimp housings and insulation displacement connectors

Meets compliance standards including EU RoHS and REACH, ensuring safety and regulatory adherence

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