Molex 90131 Series Vertical Through Hole PCB Header, 80 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The Molex C-Grid III Header is designed for high-performance connectivity in PCB applications. This dual-row, vertical header accommodates up to 80 circuits, providing a reliable Interface for signal and wire-to-board connections. With a pitch of 2.54mm, it is optimally engineered for Compact layouts while allowing ease of installation. Constructed with brass and coated with gold and tin for enhanced conductivity, this component ensures excellent electrical performance. Its robust build ensures durability and longevity, making it suitable for a wide range of electronic applications. The partial gold plating offers additional protection, fortifying its performance under varying conditions. Ideal for professional environments, it represents a precise solution for demanding requirements.

Compatible with various PCB configurations, adding to versatility
Operating temperature range of -55° to +125°C ensures adaptability in diverse environments
Wave solder process capability promotes easy integration into automated manufacturing setups
Designed without keying for broad compatibility with mating parts
Stackable feature allows for Compact design in complex applications