Molex 55917 Series Vertical Through Hole PCB Header, 12 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 691-927
- Référence fabricant:
- 55917-1210
- Fabricant:
- Molex
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau en stock, il n'est plus vendu par le fabricant.
- N° de stock RS:
- 691-927
- Référence fabricant:
- 55917-1210
- Fabricant:
- Molex
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Series | 55917 | |
| Product Type | PCB Header | |
| Pitch | 2mm | |
| Current | 3A | |
| Housing Material | Polyester | |
| Number of Contacts | 12 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Row Pitch | 2mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 3.2mm | |
| Standards/Approvals | UL E29179 | |
| Voltage | 250Vrms | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Series 55917 | ||
Product Type PCB Header | ||
Pitch 2mm | ||
Current 3A | ||
Housing Material Polyester | ||
Number of Contacts 12 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Row Pitch 2mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 3.2mm | ||
Standards/Approvals UL E29179 | ||
Voltage 250Vrms | ||
- Pays d'origine :
- VN
The Molex MicroClasp Wire-to-Board Header is designed for reliable electrical connections in a Compact form. This dual-row, vertical header accommodates up to 12 circuits, making it an Ideal choice for efficient signal transmission in various applications. Constructed with Durable polyester resin and featuring a tin-plated Interface for enhanced conductivity, it supports a maximum current of 3.0A and a voltage of up to 250V AC/DC. Its integration of a PCB locator ensures precise alignment during assembly, while a robust design maintains functionality across a wide temperature range of -40° to +105°C. The MicroClasp header meets industry compliance standards, reinforcing its role as a dependable component for modern electronic devices.
Supports up to 12 circuits for versatile connectivity needs
Designed for wire-to-board applications, ensuring secure signal transmission
Constructed from natural resin, providing robustness and longevity
Tin-plated mating surfaces enhance electrical conductivity for efficient performance
Operating temperature range ensures reliability in diverse environments
PCB locator feature facilitates accurate alignment during installation
Durability of up to 30 mating cycles allows for repeated use without compromise
Vertical orientation optimises space in tight electronic assemblies
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