Molex 46556 Series Vertical Surface Mount PCB Header, 160 Contact(s), 1.27 mm Pitch, 4 Row, Unshrouded

Sous-total (1 bobine de 250 unités)*

8 407,88 €

(TVA exclue)

10 173,53 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 29 juin 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s)
la bobine
Prix par unité*
1 +8 407,88 €33,632 €

*Prix donné à titre indicatif

N° de stock RS:
691-704
Référence fabricant:
46556-4345
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Series

46556

Product Type

PCB Header

Current

2.7A

Pitch

1.27mm

Number of Contacts

160

Housing Material

High Temperature Thermoplastic

Number of Rows

4

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Surface Mount

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Row Pitch

1.27mm

Maximum Operating Temperature

125°C

Standards/Approvals

CSA LR19980, UL E29179, EU RoHS, Low-Halogen

Voltage

240V

Pays d'origine :
MY
The Molex Searay slim plug is engineered for board-to-board connectivity, optimising signal integrity across various applications. This innovative connector features 160 circuits with a Compact 3.50mm unmated height, enabling efficient space utilisation and a streamlined design. Ideal for complex assemblies, it employs a robust solder charge design that meets lead-free requirements, ensuring compliance with modern environmental standards. With vertical orientation and a Durable construction, the searay slim plug is compatible with a wide array of receptacles, making it a versatile choice for demanding electronic environments.

160 circuits provide extensive connectivity options for Advanced designs
Lead-free and compliant with EU RoHS ensuring environmental sustainability
High-temperature thermoplastic resin enhances durability under rigorous conditions
Vertical orientation optimises space, perfect for Compact applications
Gold-plated mating surfaces ensure excellent conductivity and reliability
Surface mount termination style allows for easy integration into PCBs

Liens connexes