Molex 42385 Series Vertical Through Hole PCB Header, 18 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

Sous-total (1 plateau de 20 unités)*

284,00 €

(TVA exclue)

343,64 €

(TVA incluse)

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  • Expédition à partir du 29 mai 2026
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Prix par unité*
1 +284,00 €14,20 €

*Prix donné à titre indicatif

N° de stock RS:
685-087
Référence fabricant:
15-24-7187
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

42385

Pitch

4.2mm

Current

13A

Number of Contacts

18

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

4.2mm

Tail Pin Length

3.56mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

600 V

Pays d'origine :
MX
The Molex Mini-Fit BMI Receptacle is expertly designed for seamless connectivity in board to board and wire to board applications, boasting a reliable 4.20mm pitch configuration. This product features a dual-row, vertical orientation, ensuring efficient space utilisation on PCBs. Crafted from high-quality materials, including nylon resin and phosphor bronze, it delivers durability and robustness required in demanding environments. With a maximum current rating of 9.0A and voltage support of 600V AC( RMS)/DC, it is well-suited for various electronic uses. The receptacle’s design includes snap-in plastic pegs for secure mounting and incorporates low-halogen and compliance with environmental regulations, enhancing product safety and responsibility.

Suitable for high-density applications with a dual-row design

Snap-in plastic pegs ensure secure attachment to PCBs

Natural (white) resin offers versatility in appearance and compatibility

Improved electrical performance with a maximum voltage of 600V AC/DC

Utilises gold plating for enhanced conductivity and durability

Meets low-halogen and REACH SVHC standards for environmental compliance

Compatible with various molex headers which enabling flexible assembly configurations

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