Molex 5569 Series Right Angle PCB PCB Header, 16 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

Sous-total (1 sachet de 50 unités)*

307,00 €

(TVA exclue)

371,47 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 22 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Sachet(s)
Le Sachet
Prix par unité*
1 +307,00 €6,14 €

*Prix donné à titre indicatif

N° de stock RS:
684-809
Référence fabricant:
39-30-1162
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Product Type

PCB Header

Series

5569

Current

13A

Pitch

4.2mm

Housing Material

Nylon

Number of Contacts

16

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Row Pitch

4.2mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

600 V

Pays d'origine :
MX
The Molex Mini-Fit Jr. Header offers a robust solution for connecting dual row configurations in wire to board applications. Designed with a right-angle orientation and an innovative snap-in plastic peg for enhanced PCB locking, this component provides a reliable connection with up to 16 circuits. Constructed from durable PA Polyamide Nylon 6/6 material and featuring select Gold plating, the Mini-Fit Jr. ensures excellent conductivity and longevity even under demanding conditions, making it ideal for power applications. It operates effectively across a temperature range of -40° to +105°C, supporting various electronic designs while maintaining compliance with industry standards.

Designed for up to 16 circuits which enabling efficient multi-connection

Right-angle orientation maximises space utilization on PCBs

Snap-in peg ensures secure PCB locking for reliable connections

Constructed from durable nylon plastic for improved resilience

Gold plating enhances conductivity and reduces contact resistance

Bag packaging provides convenience and protection during transport

Features a through-hole termination interface for easy assembly

Liens connexes