Molex 105312 Series Vertical Through Hole PCB Header, 16 Contact(s), 2.5 mm Pitch, 2 Row, Shrouded

Sous-total (1 plateau de 60 unités)*

219,00 €

(TVA exclue)

264,99 €

(TVA incluse)

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  • Expédition à partir du 23 janvier 2026
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Prix par unité*
1 +219,00 €3,65 €

*Prix donné à titre indicatif

N° de stock RS:
684-592
Référence fabricant:
105312-2216
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

105312

Current

8A

Pitch

2.5mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

16

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

Brass

Row Pitch

2.5mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Tail Pin Length

3.2mm

Standards/Approvals

RoHS

Voltage

250 V

Pays d'origine :
CN
The Molex Nano-Fit Vertical Header is engineered for robust high-performance wiring applications integrating precision with reliability. Designed with a 2.50mm pitch this dual-row connector accommodates up to 16 circuits ensuring compatibility with a wide range of wire to board assemblies. Its through-hole termination style promotes secure PCB attachment while the natural liquid crystal polymer construction delivers exceptional durability and heat resistance. The header is also glow-wire capable making it ideal for applications where fire safety is paramount. Its gold plating ensures excellent conductivity adding an extra layer of reliability to power connections.

Compact dual-row design optimises space utilisation on PCBs

Glow-wire capable meeting stringent safety standards for temperature resilience

Durable brass metal contacts with gold plating enhance performance longevity

Optimised for applications with up to 8.0A current handling capacity per contact

Vertical orientation facilitates efficient wire management and access

Includes PCB retention features for secure component positioning

Compliance with multiple industry standards ensures product integrity and trust

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