Molex 215760 Series Right Angle Through Hole PCB Header, 7 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Sous-total (1 plateau de 150 unités)*

240,54 €

(TVA exclue)

291,05 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 01 juin 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +240,54 €1,604 €

*Prix donné à titre indicatif

N° de stock RS:
684-424
Référence fabricant:
215760-1007
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Series

215760

Product Type

PCB Header

Pitch

3mm

Number of Contacts

7

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Row Pitch

3mm

Standards/Approvals

RoHS

Pays d'origine :
CN
The Molex Micro-Fit+ Right-Angle Header is an advanced interconnect solution designed for efficient power distribution in various electronic applications. This header features a robust single-row configuration with seven circuits, making it ideal for use in environments requiring space-saving designs. The 3.00mm pitch optimises board space while ensuring reliable connection integrity, and the matte tin plating contributes to enhanced conductivity. The Micro-Fit+ design is glow-wire capable, allowing it to perform safely in high-temperature conditions, while its black liquid crystal polymer construction offers durability and resistance to various environmental factors. Whether for power or wire-to-board applications, this header is built to meet the rigorous demands of modern electronic systems.

Glow wire capable design enhances safety in high temperature environments

Black resin construction delivers durability and resistance to external factors

Matte tin plating ensures excellent conductivity and reliability

Single row, seven circuit configuration optimises space in compact designs

PCB retention feature provides secure mounting on the board

Ideal for power and wire to board applications, enhancing system performance

Utilises high copper alloy for effective electrical conductivity

Liens connexes