Molex 216571 Series Vertical PCB PCB Header, 8 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Sous-total (1 plateau de 80 unités)*

254,88 €

(TVA exclue)

308,40 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 23 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +254,88 €3,186 €

*Prix donné à titre indicatif

N° de stock RS:
684-162
Référence fabricant:
216571-3008
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Product Type

PCB Header

Series

216571

Pitch

3mm

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Row Pitch

3mm

Standards/Approvals

RoHS

Pays d'origine :
CN
The Molex Micro-Fit+ Vertical Header is engineered for optimal power delivery in wire-to-board applications. This product features a compact design with a pitch of 3.00mm and accommodates up to 8 circuits, ensuring efficient and reliable connections. Constructed with high-quality materials, the Micro-Fit+ is compliant with leading industry standards, catering to diverse environments and applications. Its robust design incorporates glow-wire capability and is rated for exceptional durability with a life expectancy of 200 mating cycles, making it an ideal choice for demanding electronic setups. The Micro-Fit+ additionally offers compatibility with a range of mating parts, enhancing versatility in complex assembly requirements.

Designed for PCB Headers and Receptacles with a single row configuration

Constructed from a high copper alloy for superior electrical performance

Features a liquid crystal polymer resin for enhanced thermal stability

Meets rigorous compliance standards, including EU RoHS and REACH regulations

Offers low halogen status per IEC standards for environmentally conscious applications

Provides a durable, vertical orientation suited for compact spaces

Incorporates a solderable termination interface style for reliable connections

Liens connexes