Molex 71395 Series Vertical Surface PCB Header, 44 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Sous-total (1 plateau de 20 unités)*

300,88 €

(TVA exclue)

364,06 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 29 juin 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +300,88 €15,044 €

*Prix donné à titre indicatif

N° de stock RS:
683-987
Référence fabricant:
15-45-3144
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Product Type

PCB Header

Series

71395

Pitch

2.54mm

Current

2.5A

Number of Contacts

44

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

250 V

Pays d'origine :
MY
The Molex C-Grid connector is a high-performance solution designed for efficient board-to-board and signal connections. With a 2.54mm pitch and support for up to 44 circuits, it ensures reliable connectivity in compact applications. This surface mount, high-profile connector features a durable construction using high-temperature thermoplastic and offers excellent electrical performance with a maximum voltage of 250V AC. It’s engineered for precision, facilitating seamless integration into various PCB designs while maintaining robustness under operational stress. The C-Grid is ideally suited for applications requiring dependable connections with minimal space constraints, making it an essential choice for modern electronic devices.

Mates seamlessly with various connectors, enhancing flexibility in design

Durability rated for up to 50 mating cycles, ensuring longevity

Black resin provides an aesthetic finish while maintaining structural integrity

Suitable for both board-to-board and signal applications, broadening usability

Liens connexes