TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 677-531
- Référence fabricant:
- 6376611-1
- Fabricant:
- TE Connectivity
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 677-531
- Référence fabricant:
- 6376611-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | Connector Assembly | |
| Series | Micro Stack | |
| Current | 500mA | |
| Pitch | 0.6mm | |
| Number of Contacts | 80 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Board | |
| Connector System | Board-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL | |
| Voltage | 10V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type Connector Assembly | ||
Series Micro Stack | ||
Current 500mA | ||
Pitch 0.6mm | ||
Number of Contacts 80 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Board | ||
Connector System Board-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL | ||
Voltage 10V | ||
- Pays d'origine :
- CN
The TE Connectivity PCB Mount Header is optimized for high-density board-to-board signal transmission in Compact electronic designs. With 80 positions and a fine 0.6 mm [.023 in] centerline spacing, it enables efficient routing while conserving valuable PCB real estate. Its partially shrouded vertical surface-mount configuration ensures precise mating and supports automated assembly.
80 Positions for dense signal interconnects
0.6 mm [.023 in] Centerline spacing for Compact layouts
Partially Shrouded Housing improves alignment and mechanical stability
Gold-Plated Contacts (Au) for superior conductivity and corrosion resistance
Surface-Mount Design supports streamlined board stacking and reflow soldering
Liens connexes
- TE Connectivity Micro Stack Series Vertical Board Connector Assembly 0.6 mm Pitch Shrouded
- TE Connectivity FH Series Vertical Board Connector Assembly 0.6 mm Pitch Shrouded
- TE Connectivity MICTOR Series Vertical Board Connector Assembly 0.8 mm Pitch Shrouded
- TE Connectivity Micro MATE-N-LOK Series Vertical Board Connector Assembly 3 mm Pitch Shrouded
- TE Connectivity Micro MATE-N-LOK Series Vertical Board Connector Assembly 3 mm Pitch Shrouded
- TE Connectivity Free Height Series Vertical Board Connector Assembly 0.8 mm Pitch Shrouded
- TE Connectivity Micro-MaTch Industrial Series Vertical Board Connector Assembly 1.27 mm Pitch
- TE Connectivity Micro-MaTch Industrial Series Vertical Board Connector Assembly 1.27 mm Pitch