Molex 43045 Series Right Angle Through Hole PCB Header, 14 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Offre groupée disponible

Sous-total (1 paquet de 2 unités)*

8,28 €

(TVA exclue)

10,02 €

(TVA incluse)

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Temporairement en rupture de stock
  • Expédition à partir du 11 mai 2026
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Paquet(s)
le paquet
Prix par unité*
1 - 98,28 €4,14 €
10 - 247,62 €3,81 €
25 +6,88 €3,44 €

*Prix donné à titre indicatif

N° de stock RS:
666-059
Référence fabricant:
430451422
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

43045

Current

8.5A

Pitch

3mm

Housing Material

Thermoplastic

Number of Contacts

14

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Contact Gender

Male

Maximum Operating Temperature

125°C

Pays d'origine :
CN
The Molex Micro-Fit 3.0 Right-Angle Header is designed for efficient power distribution in a Compact form factor. Featuring a 3.00mm pitch and dual row configuration, this header accommodates 14 circuits while ensuring reliable connectivity through its PCB press-fit metal retention clip. Crafted to withstand high temperatures and designed for easy integration, the Micro-Fit 3.0 offers a robust solution for wire-to-board applications. Its gold-plated contacts provide enhanced conductivity, making it Ideal for power-intensive projects. Whether in household appliances or automotive systems, this header meets the stringent requirements for safety and performance, making it a versatile choice for engineers seeking high-quality interconnect solutions.

Maximum current capability of 8.5A allows for substantial power delivery
Compact design with dual row configuration saves PCB space
Gold plating on contacts ensures optimal electrical conductivity
Fully shrouded for secure mating and retention, reducing connection failures
Rated for a temperature range of -40° to +125°C, catering to diverse environmental conditions

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