Molex 70541 Series Vertical Through Hole PCB Header, 2 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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Sous-total (1 paquet de 5 unités)*

7,98 €

(TVA exclue)

9,66 €

(TVA incluse)

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Paquet(s)
le paquet
Prix par unité*
1 - 47,98 €1,596 €
5 - 97,33 €1,466 €
10 +6,62 €1,324 €

*Prix donné à titre indicatif

N° de stock RS:
665-849
Référence fabricant:
705410036
Fabricant:
Molex
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Marque

Molex

Series

70541

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Number of Contacts

2

Housing Material

Polyamide

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Gold

Contact Material

Brass Phosphor Bronze

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Contact Gender

Male

Pays d'origine :
MY
The Molex SL Header is designed for high-performance signal and wire-to-board applications, combining reliability with ease of use. This single-row, vertical component features a 2.54mm pitch and supports a Compact design with 2 circuits. Constructed with high-temperature thermoplastic and brass metal, its robustness ensures longevity even in demanding environments. With a maximum current rating of 3.0A and voltage capacity of up to 250V, this product meets industry standards while maintaining a lightweight profile. Shrouded and fully polarized, the SL Header prevents misalignment during connections, providing secure and efficient operation suitable for a range of electronic devices.

Constructed from high-temperature thermoplastic for enhanced durability
Designed with 2 circuits, offering versatility in applications
Features a shrouded design to protect against accidental disconnections
Polarized Interface ensures proper mating and prevents misalignment
Rated for a maximum of 3.0A current, perfect for reliable electrical performance
Supports a voltage capacity of 250V, making it suitable for various applications
Lightweight design at just 0.599g, facilitating easy integration into devices
Compatible with lead-free solder processes, aligning with modern manufacturing standards

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