Molex 46207 Series Vertical Through Hole PCB Header, 8 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

Offre groupée disponible

Sous-total (1 paquet de 2 unités)*

7,52 €

(TVA exclue)

9,10 €

(TVA incluse)

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  • Expédition à partir du 12 juin 2026
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Paquet(s)
le paquet
Prix par unité*
1 - 97,52 €3,76 €
10 - 246,92 €3,46 €
25 +6,25 €3,125 €

*Prix donné à titre indicatif

N° de stock RS:
665-723
Référence fabricant:
462071008
Fabricant:
Molex
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Marque

Molex

Series

46207

Product Type

PCB Header

Current

13A

Pitch

4.2mm

Number of Contacts

8

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Tin

Row Pitch

4.2mm

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Tail Pin Length

3.66mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Pays d'origine :
MX
The Molex Mini Fit Jr. Reflow Solder Capable Header is engineered for versatile connectivity in demanding electronic applications. This dual-row vertical header offers an optimal 4.20mm pitch and accommodates up to 8 circuits while ensuring reliable performance at a maximum voltage of 600V AC/DC. Crafted from durable, high-temperature thermoplastic with a matte tin plating, this header is designed to operate within a temperature range of -40° to +105°C. Ideal for board-to-board and wire-to-board applications, its innovative glow-wire capability enhances safety and efficiency during operation. The tray packaging facilitates convenient handling, making it an essential component in several electronic designs.

Glow-wire capability increases the safety quotient in sensitive applications
Matte tin plating enhances solderability and conductivity
Designed to facilitate easy mating with compatible parts, ensuring reliable connections
PCB retention features help secure the header in place, preventing disconnections
Operates effectively across a broad temperature range, suitable for various environments

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