Phoenix Contact Wave Soldering Mount PCB Header, 20 Contact(s), 3.5 mm Pitch, 2 Row, Unshrouded

Sous-total (1 paquet de 50 unités)*

443,23 €

(TVA exclue)

536,31 €

(TVA incluse)

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  • Expédition à partir du 22 janvier 2026
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le paquet
Prix par unité*
1 +443,23 €8,865 €

*Prix donné à titre indicatif

N° de stock RS:
638-563
Référence fabricant:
1787289
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

20

Number of Rows

2

Shrouded/Unshrouded

Unshrouded

Connector System

COMBICON DFMC 1.5

Mount Type

Wave Soldering Mount

Contact Plating

Tin

Contact Material

Copper Alloy

Row Pitch

3.5mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Tail Pin Length

2mm

Maximum Operating Temperature

100°C

Contact Gender

Male

Mating Pin Length

2mm

Standards/Approvals

cULus, IEC 60068-2-70, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60512-9-1, IEC 60664-1, ISO 6988, VDE

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact PCB Header is engineered for seamless integration into the surface-mount technology soldering process, offering a reliable connection in compact designs. Its efficient design features linear pinning and is perfectly suited for wave soldering, ensuring high performance and operational longevity. The product seamlessly accommodates four potentials across two rows and is compatible with the COMBICON DFMC 1.5 pin connector. Ideal for spaces where size constraints are paramount, the device's meticulous engineering guarantees durability and operational excellence even under challenging conditions. With its black housing constructed from LCP, this product not only meets stringent industry standards but also provides exceptional thermal stability.

Features moisture sensitive level classification for safe handling

Ensures compliance with WEEE and RoHS directives for environmental safety

Supported by extensive documentation for streamlined installation

Constructed to endure multiple solder cycles during assembly processes

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