Phoenix Contact Parallel Wave Soldering Mount PCB Header, 4 Contact(s), 3.81 mm Pitch, 1 Row, Unshrouded

Sous-total (1 paquet de 50 unités)*

80,60 €

(TVA exclue)

97,53 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 05 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +80,60 €1,612 €

*Prix donné à titre indicatif

N° de stock RS:
638-162
Référence fabricant:
1341119
Fabricant:
Phoenix Contact
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Phoenix Contact

Product Type

PCB Header

Current

8A

Pitch

3.81mm

Housing Material

Polybutylene Terephthalate

Number of Contacts

4

Number of Rows

1

Orientation

Parallel

Shrouded/Unshrouded

Unshrouded

Mount Type

Wave Soldering Mount

Connector System

CONNEXIS

Contact Material

Copper Alloy

Contact Plating

Tin

Termination Type

Solder

Row Pitch

3.81mm

Minimum Operating Temperature

-55°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Tail Pin Length

3.8mm

Standards/Approvals

DIN EN 61984, IEC 60068-2-70, IEC 60112, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60664-1, UL Recognised Approval ID: E118976-20240617

Mating Pin Length

3.8mm

Voltage

160 V

Pays d'origine :
CN
The Phoenix Contact PCB Header represents a pinnacle of connectivity and efficiency designed to facilitate robust electronic assemblies. Engineered for performance in a compact form, it is an integral component for various circuit connections. Its black housing and precise pin arrangement ensure a seamless integration within PCB layouts, allowing for reliable connections tailored to demanding applications.

Equipped with a plug in system that allows for simple integration into existing setups

Optimised for a broad temperature range for diverse environmental conditions

Delivers excellent contact resistance measurements for improved signal integrity

Facilitates easy assembly and maintenance with its intuitive design

Liens connexes