Samtec NVAM Series Straight Surface PCB Header, 32 Contact(s), 0.8 mm Pitch, 4 Row, Shrouded
- N° de stock RS:
- 637-620
- Référence fabricant:
- NVAM-DP-04-1-02.0-S-2-K-TR
- Fabricant:
- Samtec
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 unité)*
29,41 €
(TVA exclue)
35,59 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 21 juillet 2026
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Unité | Prix par unité |
|---|---|
| 1 - 9 | 29,41 € |
| 10 + | 27,06 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 637-620
- Référence fabricant:
- NVAM-DP-04-1-02.0-S-2-K-TR
- Fabricant:
- Samtec
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Series | NVAM | |
| Product Type | PCB Header | |
| Current | 9.9A | |
| Pitch | 0.8mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 32 | |
| Number of Rows | 4 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Contact Plating | Gold over Nickel | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 0.8mm | |
| Termination Type | BGA Attachment Termination | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCI Express, PCI-SIG | |
| Voltage | 255V | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Series NVAM | ||
Product Type PCB Header | ||
Current 9.9A | ||
Pitch 0.8mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 32 | ||
Number of Rows 4 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Contact Plating Gold over Nickel | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 0.8mm | ||
Termination Type BGA Attachment Termination | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCI Express, PCI-SIG | ||
Voltage 255V | ||
The Samtec Extreme density and performance terminal is a 0.80 mm pitch, high-speed board-to-board connector engineered for ultra-high-density applications. Designed for signal integrity up to 112 Gbps PAM4, it features a vertical mount, optimized for extreme performance in compact layouts.
Fully shielded differential pair design for low crosstalk
Gold plated contacts for optimal signal integrity
High temp LCP insulation rated UL94 V 0