Phoenix Contact MC Series Through Hole PCB Header, 3 Contact(s), 3.5 mm Pitch, 1 Row, Shrouded

Sous-total (1 paquet de 330 unités)*

906,08 €

(TVA exclue)

1 096,36 €

(TVA incluse)

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  • Expédition à partir du 12 août 2026
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le paquet
Prix par unité*
1 +906,08 €2,746 €

*Prix donné à titre indicatif

N° de stock RS:
557-361
Référence fabricant:
1011128
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Series

MC

Product Type

PCB Header

Current

8A

Pitch

3.5mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

3

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON MC 1.5

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder Mount

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

100°C

Tail Pin Length

1.4mm

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

1.4mm

Voltage

160V

Pays d'origine :
DE
The Phoenix Contact robust PCB header designed for seamless integration into modern electronic devices. This versatile component supports various connection technologies, making it an ideal choice for designers seeking flexibility in their device configurations. With a nominal current capacity of 8 A and a rated voltage of 160 V, it ensures reliable performance in demanding applications. The header features a THR soldering mounting type for convenient assembly, providing mechanical stability through its screw-locking mechanism. Its compact design, with a 3.5 mm pitch and linear pinning layout, facilitates efficient space utilisation on PCBs, whilst its durable construction is compliant with industry standards, thus ensuring long-lasting usability in harsh environments.

Designed for effortless integration into SMT soldering processes

Screwable flange enhances mechanical stability for reliable connections

Offers maximum flexibility for various device designs with a single header solution

Compliant with WEEE and RoHS regulations, ensuring environmental safety

Robust construction withstands rigorous operational conditions

Optimised for through-hole reflow soldering, streamlining assembly efficiency

Resistant to corrosion and thermal stress for enhanced durability

Compact dimensions support space-saving in complex circuit layouts

High-quality materials used to minimise signal interference

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