Molex 21657 Series Vertical Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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Sous-total (1 paquet de 5 unités)*

10,79 €

(TVA exclue)

13,06 €

(TVA incluse)

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Paquet(s)
le paquet
Prix par unité*
1 - 410,79 €2,158 €
5 - 99,92 €1,984 €
10 +8,95 €1,79 €

*Prix donné à titre indicatif

N° de stock RS:
536-872
Référence fabricant:
2165711043
Fabricant:
Molex
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Marque

Molex

Series

21657

Product Type

PCB Header

Current

13A

Pitch

3mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

3

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Power, Wire-to-Board

Mount Type

Through Hole

Contact Material

High Copper Alloy

Contact Plating

Matt Tin

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Maximum Operating Temperature

125°C

Contact Gender

Female

Tail Pin Length

3.18mm

Standards/Approvals

No

Voltage

600 Vrms

Pays d'origine :
CN
The Molex Micro fit+ versa Color vertical header is the ideal solution for high density connectivity in power and wire to board applications. Designed with a robust 3.00mm pitch, this through hole component offers a reliable single row and three circuits, ensuring efficient performance in a compact footprint. Its matte tin plating not only provides optimal conductivity but also offers excellent resistance to corrosion, making it suitable for various environments. Additionally, the glow wire capability enhances safety by reducing risks associated with overheating. The thoughtful design features, such as keying and locking mechanisms, facilitate secure connections that meet the demanding requirements of modern electronic devices, ensuring peace of mind for engineers and designers alike.

Low halogen construction ensures compliance with environmental standards

Durable liquid crystal polymer resin provides enhanced thermal stability

Vertical orientation optimises space in compact assemblies

Meets stringent safety certifications from CSA and UL

PCB retention features facilitate secure mounting during assembly

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