Molex 21657 Series Vertical Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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Sous-total (1 paquet de 5 unités)*

10,79 €

(TVA exclue)

13,06 €

(TVA incluse)

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Paquet(s)
le paquet
Prix par unité*
1 - 410,79 €2,158 €
5 - 99,92 €1,984 €
10 +8,95 €1,79 €

*Prix donné à titre indicatif

N° de stock RS:
536-814
Référence fabricant:
2165711023
Fabricant:
Molex
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Marque

Molex

Series

21657

Product Type

PCB Header

Current

13A

Pitch

3mm

Number of Contacts

3

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Power, Wire-to-Board

Mount Type

Through Hole

Contact Material

High Copper Alloy

Contact Plating

Matt Tin

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Tail Pin Length

3.18mm

Maximum Operating Temperature

125°C

Contact Gender

Female

Standards/Approvals

No

Voltage

600 Vrms

Pays d'origine :
CN
The Molex Micro fit+ versa Color Vertical Header is engineered for precision and reliability in wire to board connectivity. Designed with a compact 3.00mm pitch, it features a single row with three circuits, ensuring seamless integration into your PCB applications. The matte tin plating enhances durability while the glow wire capability adds an extra layer of safety. Its robust construction is supported by high copper alloy metal for optimal electrical performance, making it an ideal choice for power applications. With its vertical orientation and tray packaging, installation is made efficient and straightforward.

Offers unmatched reliability for aggressive environments

The vertical design streamlines PCB layout and maximises space

Matte tin plating ensures optimal conductivity and corrosion resistance

Glow wire capability meets stringent safety regulations

Compatible with high copper alloy connectors for enhanced electrical connectivity

Designed to withstand up to 25 mating cycles for long term usability

Recommended PCB thickness allows for flexible design considerations

Easy to assemble with keying features that prevent misalignment

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