Phoenix Contact DMC Series Straight Wave Soldering Mount PCB Header, 36 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

Sous-total (1 paquet de 50 unités)*

816,66 €

(TVA exclue)

988,16 €

(TVA incluse)

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  • Expédition à partir du 09 mars 2026
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le paquet
Prix par unité*
1 +816,66 €16,333 €

*Prix donné à titre indicatif

N° de stock RS:
520-908
Référence fabricant:
1874412
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

PCB Header

Series

DMC

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

36

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON DFMC 1

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Tail Pin Length

2.6mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised, IEC 60068-2-70, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-9-1, ISO 6988, VDE

Mating Pin Length

2.6mm

Voltage

160 V

Pays d'origine :
CN
The Phoenix Contact DMC 1.5/18-G1-3.5 P26THR is a state-of-the-art PCB header designed for seamless integration into various electronic applications. This component showcases a robust architecture specifically tailored for THR soldering processes, facilitating superior electronic connections. With an innovative layout that maximizes contact density, it boasts a compact size ideal for environments where space is at a premium. Built to withstand significant operational demands, this header is constructed from high-quality materials ensuring reliability and longevity. Additionally, its user-friendly design promotes efficient installation, thereby streamlining assembly processes while maintaining high-performance standards under varied environmental conditions. Equipped to handle considerable electrical specifications, this product confirms its versatility and effectiveness across multiple sectors.

Designed for effortless integration into surface-mount technology processes

Constructed for high contact density, enhancing overall connectivity

Compact design tailored for space-limited applications

Utilises high-grade materials to ensure durability and performance

Facilitates easy installation to streamline production timelines

Versatile compatibility across various electronic environments

Features innovative pin layout promoting efficient space usage

Meets rigorous international safety and quality standards

Engineered to endure extensive operational demands without compromising reliability

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