Phoenix Contact MCV Series Wave Soldering Mount PCB Header, 17 Contact(s), 3.5 mm Pitch, 1 Row, Shrouded

Voir l’ensemble des PCB Headers
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
N° de stock RS:
517-115
Référence fabricant:
1713385
Fabricant:
Phoenix Contact
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Phoenix Contact

Series

MCV

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Number of Contacts

17

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON MC 1.5

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3.5mm

Maximum Operating Temperature

100°C

Tail Pin Length

2mm

Contact Gender

Male

Mating Pin Length

2mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact MCV 1.5/17-G-3.5 P20 THR PCB header is engineered to elevate the flexibility and reliability of electronic connections. Designed specifically for surface-mount technology, this connector ensures seamless integration into assembly lines while maintaining high performance in a compact form factor. With its robust construction, it accommodates various connection technologies, allowing for a diverse range of device designs. The innovative vertical connection facilitates efficient multi-row arrangements directly on the printed circuit board (PCB), making it an indispensable component in modern electronic applications. The exceptional contact resistance ensures a stable and reliable electrical connection, whilst the meticulous design meets the highest quality standards for durability, ensuring longevity in demanding environments.

Optimised for integration into SMT soldering processes

Versatile design supporting multiple connection technologies

Vertical alignment allows efficient multi-row PCB layouts

Offers significant flexibility for device design without compromise

Robust contact surface material enhances long-term performance

Resilient against environmental factors, providing reliable operation

Lightweight construction aids in minimising overall assembly weight

Custom packaging ensures safe and efficient delivery

Liens connexes