Phoenix Contact MCV Series Vertical Through Hole PCB Header, 14 Contact(s), 3.5 mm Pitch, 1 Row, Shrouded

Sous-total (1 paquet de 50 unités)*

369,74 €

(TVA exclue)

447,39 €

(TVA incluse)

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  • Expédition à partir du 20 février 2026
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le paquet
Prix par unité*
1 +369,74 €7,395 €

*Prix donné à titre indicatif

N° de stock RS:
517-114
Référence fabricant:
1713381
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Series

MCV

Product Type

PCB Header

Current

8A

Pitch

3.5mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

14

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MC 1.5

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Tail Pin Length

2mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised E60425-20110128, VDE 40011723

Mating Pin Length

2mm

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact PCB header is designed specifically for seamless integration into modern devices, offering a versatile solution for various connection needs. Engineered to support a nominal current of 8 A and rated voltages up to 160 V, it combines compact dimensions with sturdy construction. The unique vertical connection enables efficient multi-row arrangements on printed circuit boards, thereby enhancing space utilisation and facilitating faster assembly. With its robust soldering capabilities, this product is suitable for both reflow and wave soldering, ensuring reliable performance within your applications. Additional attention has been given to durability and compliance, making it an excellent choice for developers looking for reliable and long-lasting component solutions in their electronic assemblies.

Designed for smooth integration into the SMT soldering process

Facilitates multi-row configurations, optimising PCB layout

Supports various connection technologies with a single header model

Constructed to withstand moisture sensitivity levels, enhancing longevity

Features a tin-plated contact surface for improved conductivity

Compliant with environmental standards, promoting sustainable practices

Robust construction ensures reliability under thermal stress

LCP housing material provides high resistance to thermal degradation

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