Molex 87437 Series Vertical Through Hole PCB Header, 24 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 900 unités)*

874,13 €

(TVA exclue)

1 057,70 €

(TVA incluse)

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  • Expédition à partir du 08 juin 2026
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Bobine(s)
la bobine
Prix par unité*
1 +874,13 €0,971 €

*Prix donné à titre indicatif

N° de stock RS:
507-530
Référence fabricant:
87437-1573
Fabricant:
Molex
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Marque

Molex

Series

87437

Product Type

PCB Header

Current

2.5A

Pitch

4.2mm

Number of Contacts

24

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

Brass

Row Pitch

4.2mm

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Standards/Approvals

94V-0, CSA LR19980, UL E29179

Voltage

250 Vrms

Distrelec Product Id

304-62-752

Pays d'origine :
MY
The TE Connectivity Pico-SPOX PCB Header is a robust and versatile solution, designed specifically for surface mount applications requiring a reliable interconnection. Featuring a compact 1.50mm pitch, this single-row connector supports up to 15 circuits, making it ideal for applications that demand space-efficient designs without compromising performance. Constructed with a durable nylon resin and brass components, the product ensures longevity and stability in various operating conditions. Its friction lock mechanism provides secure mating, while the tin plating enhances conductivity and protects against corrosion. Whether for signal transmission or wire-to-board connections, this product meets stringent compliance standards, delivering peace of mind alongside performance.

Compact design optimises space utilisation in electronics

Friction lock feature ensures a secure connection during operation

Supports diverse applications enhancing versatility

Constructed with high quality materials for increased durability

Meets EU RoHS compliance ensuring environmental responsibility

Robotic placement capability simplifies assembly processes

Vertical orientation allows for efficient circuit board layouts

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