TE Connectivity Grace Inertia Series Vertical Board PCB Header, 8 Contact(s), 3.3 mm Pitch, 2 Row, Shrouded

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Sous-total (1 plateau de 150 unités)*

246,41 €

(TVA exclue)

298,16 €

(TVA incluse)

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  • Expédition à partir du 01 avril 2026
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Prix par unité*
1 +246,41 €1,643 €

*Prix donné à titre indicatif

N° de stock RS:
505-815
Référence fabricant:
5-1827393-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

Grace Inertia

Product Type

PCB Header

Pitch

3.3mm

Current

4A

Number of Contacts

8

Housing Material

Polyamide 66 Fibreglass

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Row Pitch

3.3mm

Termination Type

Solder

Minimum Operating Temperature

30°C

Maximum Operating Temperature

105°C

Tail Pin Length

3mm

Standards/Approvals

UL 94V-0

Voltage

250 V

Pays d'origine :
US
The TE Connectivity PCB Mount Header offers a sophisticated and reliable solution for wire-to-board connectivity in compact applications. Designed with an 8-position configuration and a 3.3 mm centreline, it ensures optimal space utilisation while maintaining robust performance. Its fully shrouded design not only enhances safety but also simplifies the mating process, promoting secure connections even in challenging environments. The component features a tin-plated surface, providing superior protection against corrosion and wear. Suitable for a variety of industries, this header is poised to meet the demands of modern electronic designs where performance and reliability are paramount.

Utilises robust nylon material to withstand various environmental conditions

Provides excellent mechanical retention through its locking window feature

Supports through-hole solder termination for enhanced durability

Features a rectangular contact shape for reliable electrical connections

Incorporates keying mechanisms to prevent mismating

Offers a maximum operating temperature of 105 °C, ensuring reliability in high-heat scenarios

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