TE Connectivity 2327 Series Vertical Board PCB Header, 84 Contact(s), 0.6 mm Pitch, 2 Row, Unshrouded
- N° de stock RS:
- 504-102
- Numéro d'article Distrelec:
- 304-64-004
- Référence fabricant:
- 2327678-7
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 350 unités)*
2 783,50 €
(TVA exclue)
3 368,04 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 06 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 2 783,50 € | 7,953 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 504-102
- Numéro d'article Distrelec:
- 304-64-004
- Référence fabricant:
- 2327678-7
- Fabricant:
- TE Connectivity
Spécifications
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | PCB Header | |
| Series | 2327 | |
| Current | 1.1A | |
| Pitch | 0.6mm | |
| Number of Contacts | 84 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Row Pitch | 0.6mm | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | 2016, China RoHS 2 Directive MIIT Order No 32, DDIMM, EDSFF, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, Gen-Z | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type PCB Header | ||
Series 2327 | ||
Current 1.1A | ||
Pitch 0.6mm | ||
Number of Contacts 84 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Row Pitch 0.6mm | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals 2016, China RoHS 2 Directive MIIT Order No 32, DDIMM, EDSFF, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, Gen-Z | ||
- Pays d'origine :
- CN
The TE Connectivity Cutting-edge sliver connector is engineered for optimal performance in high-density applications. Designed specifically for PCB edge card interfaces, this component combines robust construction with precision engineering, ensuring reliable connectivity across various electronic systems. The sliver connector adheres to industry standards including DDIMM, EDSFF, and Gen-Z, making it an exceptional choice for internal I/O applications. With features such as a dual-row configuration and vertical PCB mounting orientation, this product stands out for its efficiency in space utilisation while maintaining excellent operational integrity. Thanks to its durable materials and thoughtful construction, this connector is capable of withstanding demanding conditions, ensuring a long service life while facilitating seamless data transmission.
Supports dual row arrangements for enhanced connectivity
Ensures vertical mounting for optimal PCB space efficiency
Crafted from high quality materials for durability and longevity
Complies with stringent industry standards for reliability
Effectively handles signals making it suitable for various applications
Low halogen content contributes to environmental safety
Facilitates easy integration into existing systems with standardised dimensions
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