TE Connectivity AMPMODU Series Vertical Surface PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

Sous-total (1 bobine de 500 unités)*

1 970,16 €

(TVA exclue)

2 383,89 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +1 970,16 €3,94 €

*Prix donné à titre indicatif

N° de stock RS:
503-342
Référence fabricant:
1241150-6
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

5A

Pitch

2.54mm

Housing Material

Polycyclohexylenedimethylene Terephthalate Fibreglass

Number of Contacts

6

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Connector System

Board-to-Board

Contact Material

Copper Zinc Phosphor Bronze

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0

Distrelec Product Id

304-53-660

Pays d'origine :
PL
The TE Connectivity PCB Mount Header is designed for vertical board-to-board applications, offering a reliable connection with six positions on a compact 2.54 mm centreline. Engineered with a breakaway header type, it simplifies the modular assembly process while maintaining a robust electrical performance. The combination of gold (Au) and nickel plating ensures excellent conductivity and durability. With its unique features tailored for signal applications, this connector stands out in any electronic system. The housing, constructed from PCT GF material, is built to endure standard operating temperatures ranging from -65 °C to 105 °C, making it suitable for various environmental conditions. Engineered for seamless integration and optimal functionality, this product guarantees a secure and efficient connection, ensuring the integrity of your electronic devices at all times.

Provides a dependable connection for board-to-board configurations

Facilitates easy mounting with a vertical orientation

Designed for high-density applications without compromising space

Complements both PCB surface mount and assembly processes

Optimised for signal application in various electronic devices

Adheres to industry standards for reliability and safety

Complies with EU regulations for RoHS and REACH

Features a packaging quantity that meets batch needs for manufacturing

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