TE Connectivity AMPMODU Series Vertical Board PCB Header, 24 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 72 unités)*

238,13 €

(TVA exclue)

288,14 €

(TVA incluse)

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  • Expédition à partir du 18 mai 2026
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Tube(s)
le tube
Prix par unité*
1 +238,13 €3,307 €

*Prix donné à titre indicatif

N° de stock RS:
503-315
Référence fabricant:
1-535542-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Fibreglass Polyester

Number of Contacts

24

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold Plated

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

125°C

Contact Gender

Female

Tail Pin Length

3.3mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

333 V

Distrelec Product Id

304-63-897

Pays d'origine :
CN
The TE Connectivity PCB mount receptacle offers a robust and reliable connection solution designed specifically for vertical board-to-board applications. With 24 positions and a 2.54 mm centerline spacing, it ensures seamless integration into your electronics, promoting efficient space utilisation and enhanced performance. The gold-plated contacts deliver exceptional conductivity and longevity, making it ideal for applications requiring frequent connections. Crafted from high-quality materials, this connector guarantees resilience against environmental stressors, ensuring stability across a broad operating temperature range. Its innovative design supports stacked configurations, providing versatility in various electronics projects. The receptacle is compatible with a range of modular connector systems, streamlining your design process and enhancing overall connectivity.

Offers exceptional conductivity due to gold-plated contacts

Designed for easy integration into compact electronic layouts

Supports both bottom and top mating entry locations

Facilitates board standoff solder processes for efficient assembly

Built to endure a wide operating temperature range from -65 to 125 °C

Constructed from durable materials to withstand mechanical stress

Allows for stackable arrangements to maximise circuit board space

Features parallel board-to-board configuration for straightforward applications

Complies with industry standards for enhanced reliability and safety

Available in a packaging quantity that suits both small and large-scale projects

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