TE Connectivity Fortis Zd Series Right Angle Panel PCB Header, 180 Contact(s), 0.08 mm Pitch, 9 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 11 unités)*

4 118,08 €

(TVA exclue)

4 982,88 €

(TVA incluse)

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Temporairement en rupture de stock
  • Expédition à partir du 27 février 2026
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Tube(s)
le tube
Prix par unité*
1 +4 118,08 €374,371 €

*Prix donné à titre indicatif

N° de stock RS:
501-760
Numéro d'article Distrelec:
304-49-626
Référence fabricant:
2102247-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

Fortis Zd

Product Type

PCB Header

Current

1.5A

Pitch

0.08mm

Number of Contacts

180

Number of Rows

9

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Panel

Minimum Operating Temperature

65°C

Row Pitch

0.08mm

Maximum Operating Temperature

125°C

Standards/Approvals

2016 No Restricted Materials Above Threshold, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant

Pays d'origine :
US
The TE Connectivity High-speed backplane connector offers cutting-edge connectivity solutions for intricate electronic systems. Designed with nine rows and twenty columns, it provides a robust interface for PCB mounting, ensuring secure connections even in high-density applications. The fully shrouded right-angle header facilitates efficient space utilisation while protecting against accidental disconnections. Built to withstand a wide operating temperature range, this connector is optimal for diverse environments, promoting reliability in all conditions. Its lightweight construction combined with low contact current rating makes it a perfect fit for modern electronics, where precision and performance are paramount. The product embodies a symbiosis of advanced engineering and practical application, marked to enhance the efficiency of your electronic assemblies.

Provides reliable signal integrity for demanding applications

Compact design promotes maximum utilisation of space in electronic layouts

Fully shrouded for enhanced protection against environmental factors

Compatible with both traditional and advanced backplane architectures

Facilitates efficient thermal management due to its unique design

Offers versatility in various electronic assemblies and configurations

Optimal for high-density arrangements in complex circuits

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