TE Connectivity Z-PACK Series Vertical Board PCB Header, 96 Contact(s), 1.9 mm Pitch, 12 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 28 unités)*

312,77 €

(TVA exclue)

378,45 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 24 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +312,77 €11,17 €

*Prix donné à titre indicatif

N° de stock RS:
501-295
Référence fabricant:
1934306-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

Z-PACK

Pitch

1.9mm

Current

0.5A

Housing Material

Liquid Crystal Polymer

Number of Contacts

96

Number of Rows

12

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Row Pitch

1.9mm

Minimum Operating Temperature

65°C

Tail Pin Length

2.5mm

Maximum Operating Temperature

90°C

Contact Gender

Male

Mating Pin Length

6mm

Standards/Approvals

UL 94V-0

Voltage

250 V

Pays d'origine :
CN
The TE Connectivity 96 Position High Speed Backplane Connector is designed for demanding applications, offering exceptional reliability and performance. Engineered with 12 rows and 8 columns, this PCB mount header provides a fully shrouded connection that ensures maximum signal integrity. The advanced Z-PACK TinMan technology enables excellent electrical performance, making it ideal for high-speed data communication. Its robust design accommodates a 1.9 mm centreline, while maintaining a compact footprint suitable for space-constrained environments. With features tailored for both functionality and ease of use, this connector is the perfect solution for traditional backplane architectures, ensuring seamless integration in modern electronic systems.

Designed for high-speed data transmission at data rates up to 10 Gb/s

Features a guide slot for precise mating alignment and improved reliability

Constructed with durable materials to withstand operating temperatures from -65 to 90 °C

Offers effective signal arrangement for differential pairs, enhancing performance

Includes through-hole press-fit termination for robust PCB connections

Supports a traditional backplane architecture for versatile applications

Matte finish plating enhances durability and reduces wear over time

Low halogen content ensures compliance with environmental standards

Vertical PCB mount orientation allows for efficient use of space in layouts

Liens connexes