Phoenix Contact MCV Series Vertical Through Hole PCB Header, 19 Contact(s), 3.81 mm Pitch, 1 Row, Shrouded

Sous-total (1 paquet de 50 unités)*

501,79 €

(TVA exclue)

607,17 €

(TVA incluse)

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  • Expédition à partir du 20 février 2026
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le paquet
Prix par unité*
1 +501,79 €10,036 €

*Prix donné à titre indicatif

N° de stock RS:
497-111
Référence fabricant:
1828950
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Series

MCV

Product Type

PCB Header

Pitch

3.81mm

Current

8A

Number of Contacts

19

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MC 1.5

Mount Type

Through Hole

Contact Plating

Tin over Nickel

Contact Material

Copper Alloy

Termination Type

Solder Mount

Row Pitch

3.81mm

Minimum Operating Temperature

-40°C

Tail Pin Length

2mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Mating Pin Length

2mm

Standards/Approvals

cULus Recognised, DIN EN 61760-1, IEC 60068-2-58, IEC 60068-2-70, IEC 60068-2-82, IEC 60112, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60664-1, ISO 6988, JEDEC JESD 201, UL 94 V0, VDE

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact PCB header offers a seamless solution for integrating multiple connection technologies within a compact form factor. With its designed adaptability for through-hole reflow soldering and a unique one-header specification, this product excels in providing flexibility for device design. The header encompasses 19 positions with a pitch of 3.81 mm, ensuring efficient usage of space on your printed circuit board. Its versatile design not only accommodates a range of soldering methods but also enhances the potential for multi-row arrangements. Coupling high-quality materials with robust mechanical properties, this product assures reliability in demanding environments while adhering to stringent industry standards for safety and performance.

Optimised for seamless integration into the SMT soldering process

Supports multiple connection technologies within a single header configuration

Compact design enables efficient space utilisation on PCBs

Constructed for durability with RoHS compliance, ensuring environmental safety

Maintains low contact resistance for reliable electrical performance

Facilitates straightforward installation due to linear pin layout

Delivers operational versatility across various device designs

Robust packaging ensures protection during transit and storage

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